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  creat by art - high efficiency, low vf - high current capavility - high surge current capability - low power loss - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test v rrm 50 100 150 200 300 400 500 600 v v rms 35 70 105 140 210 280 350 420 v v dc 50 100 150 200 300 400 500 600 v i f(av) a t rr ns c j pf r jc c/w t j c t stg c document number: ds_d1411015 version: i14 1.7 400 typical junction capacitance (note 3) 70 50 note 3: measured at 1 mhz and applied reverse voltage of 4.0 v d.c. storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a. sf 1001g sf 1002g sf 1003g sf 1004g sf 1005g sf 1006g maximum reverse recovery time (note 2) 35 typical thermal resistance 3.5 operating junction temperature range - 55 to +150 maximum reverse current @ rated vr t j =25 c t j =100 c i r 10 a v maximum instantaneous forward voltage (note 1) @ 5 a v f peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 125 a 0.975 1.3 unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 10 sf 1007g sf 1008g maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter symbol to-220ab mechanical data case: to-220ab polarity: as marked mounting torque: 5 in-lbs maximum weight: 1.82 g (approximately) sf1001g thru sf1008g taiwan semiconductor glass passivated su p er fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
part no. part no. sf1001g sf1001g (t a =25c unless otherwise noted) document number: ds_d1411015 version: i14 packing taiwan semiconductor sf1001g thru sf1008g ratings and characteristics curves example green compound description 50 / tube sf1001g c0 c0 sf1001g c0g c0 g note 1: "x" defines voltage from 50v (sf1001g) to 600v (sf1008g) preferred part no. packing code packing code suffix sf100xg (note 1) c0 g to-220ab packing code packing code suffix package ordering information 0 2 4 6 8 10 12 050100150 average forward current (a) case temperature ( o c) fig.1 maximum forward current derating curve resistive or inductiveload with heatsink 0 30 60 90 120 150 1 10 100 peak forward surge current(a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current per leg 8.3ms single half sine wave 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics per leg t j =100 c t j =75 c t j =25 c 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 instantaneous forward current (a) forward voltage. (v) fig. 4 typical forward characteristics per leg pulse width=300 s 1% duty cycle sf1001g~sf1004g sf1005g~sf1006g sf1007g~sf1008g
min max min max a - 10.50 - 0.413 b 2.62 3.44 0.103 0.135 c 2.80 4.20 0.110 0.165 d 0.68 0.94 0.027 0.037 e 3.54 4.00 0.139 0.157 f 14.60 16.00 0.575 0.630 g 13.19 14.79 0.519 0.582 h 2.41 2.67 0.095 0.105 i 4.42 4.76 0.174 0.187 j 1.14 1.40 0.045 0.055 k 5.84 6.86 0.230 0.270 l 2.20 2.80 0.087 0.110 m 0.35 0.64 0.014 0.025 n 1.14 1.77 0.045 0.070 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1411015 version: i14 marking diagram to-220ab sf1001g thru sf1008g taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 40 50 60 70 80 90 100 1 10 100 1000 capacitance (pf) reverse voltage. (v) fig. 5 typical junction capacitance per leg sf1001g~sf1004g sf1005g~sf1008g f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1411015 version: i14 sf1001g thru sf1008g taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,


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